Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/20/2015
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Application #:
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12084793
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Filing Dt:
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08/04/2009
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Publication #:
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Pub Dt:
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12/10/2009
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Inventors:
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Kosuke Nakano, Hidekiyo Takaoka, Minoru Ueshima
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Title:
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Solder Paste and Solder Joint
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23 SENJU-HASHIDO-CHO |
| ADACHI-KU |
| TOKYO 120-8555, JAPAN |
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| 10-1, HIGASHIKOTARI 1-CHOME |
| NAGAOKAKYO-SHI |
| KYOTO 617-8555, JAPAN |
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| MICHAEL TOBIAS |
| 1629 K ST NW |
| SUITE 300 |
| WASHINGTON, DC 20006 |
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