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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/07/2010
Application #:
11915914
Filing Dt:
11/29/2007
Publication #:
Pub Dt:
12/10/2009
Inventors:
Tsuyoshi Tanaka, Masaharu Yamamoto
Title:
HERMETIC SEALING CAP, ELECTRONIC COMPONENT ACCOMMODATION PACKAGE, AND METHOD FOR PRODUCING HERMETIC SEALING CAP
Assignment: 1
Reel/Frame:
020238/0997Recorded: 12/13/2007Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/23/2007
Exec Dt:
07/17/2007
Assignee:
2-19-1, MINAMI-SUITA, SUITA-SHI,
OSAKA, JAPAN 564-0043
Correspondent:
WESTERMAN, HATTORI, DANIELS & ADRIAN LLP
1250 CONNECTICUT AVENUE NW,
SUITE 700
WASHINGTON,, DC 20036

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