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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11639012
Filing Dt:
12/13/2006
Publication #:
Pub Dt:
12/10/2009
Inventors:
Praveen Nalla, William Thie, John Boyd, Tiruchirapalli Arunagiri, Fritz C. Redeker et al
Title:
Self assembled monolayer for improving adhesion between copper and barrier layer
Assignment: 1
Reel/Frame:
018712/0072Recorded: 12/13/2006Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/12/2006
Exec Dt:
12/12/2006
Exec Dt:
12/12/2006
Exec Dt:
12/12/2006
Exec Dt:
12/12/2006
Exec Dt:
12/12/2006
Exec Dt:
12/12/2006
Assignee:
4650 CUSHING PARKWAY
FREMONT, CALIFORNIA 94538
Correspondent:
MARTINE PENILLA & GENCARELLA, LLP
710 LAKEWAY DRIVE
SUITE 200
SUNNYVALE, CA 94085

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