Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12476977
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Filing Dt:
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06/02/2009
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Publication #:
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Pub Dt:
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12/17/2009
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Inventor:
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Chao-Wen Shih
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Title:
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PACKAGE SUBSTRATE HAVING DOUBLE-SIDED CIRCUITS AND FABRICATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6, LI-HSIN ROAD, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN |
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| SCHMEISER OLSEN & WATTS |
| 18 E UNIVERSITY DRIVE |
| SUITE # 101 |
| MESA, AZ 85201 |
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