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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
8387685
Issue Dt:
03/05/2013
Application #:
11919368
Filing Dt:
09/10/2009
Publication #:
20090314474
Pub Dt:
12/24/2009
Inventors:
Masahiko Kimbara, Keiji Toh, Hidehito Kubo, Eiji Kono, Yuichi Furukawa, Katsufumi Tanaka et al
Title:
HEAT SINK FOR POWER MODULE
Assignment: 1
Reel/Frame:
022991/0245Recorded: 07/22/2009Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
KIMBARA, MASAHIKO
Exec Dt:
10/10/2007
TOH, KEIJI
Exec Dt:
10/12/2007
KUBO, HIDEHITO
Exec Dt:
10/09/2007
TANAKA, KATSUFUMI
Exec Dt:
10/11/2007
OTOSHI, KOTA
Exec Dt:
10/26/2007
KONO, EIJI
Exec Dt:
10/27/2007
WAKABAYASHI, NOBUHIRO
Exec Dt:
10/10/2007
NAKAGAWA, SHINTARO
Exec Dt:
10/04/2007
FURUKAWA, YUICHI
Exec Dt:
10/04/2007
YAMAUCHI, SHINOBU
Exec Dt:
10/04/2007
Assignees:
KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
2-1, TOYODA-CHO, KARIYA-SHI
AICHI-KEN, JAPAN 448-8671
SHOWA DENKO K. K.
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU
TOKYO, JAPAN 105-8518
Correspondent:
LOCKE LORD BISSELL & LIDDELL LLP ATTN: I
THREE WORLD FINANCIAL CENTER
NEW YORK, NY 10281-2101

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