Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11915990
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Filing Dt:
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11/29/2007
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Publication #:
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Pub Dt:
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12/24/2009
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Inventors:
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Hitoshi Kajino, Takeo Taguchi, Kanji Sato, Masahito Ishii, Tatsuo Kataoka
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Title:
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Mold for Wiring Substrate Formation and Process for Producing the Same, Wiring Substrate and Process for Producing the Same, Process for Producing Multilayered Laminated Wiring Substrate and Method for Viahole Formation
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-11-1, OSAKI |
| SHINAGAWA-KU |
| TOKYO, JAPAN 141-8584 |
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| THE WEBB LAW FIRM |
| 436 SEVENTH AVENUE |
| 700 KOPPERS BUILDING |
| PITTSBURGH, PA 15219 |
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