Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12143680
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Filing Dt:
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06/20/2008
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Publication #:
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Pub Dt:
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12/24/2009
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Inventors:
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Terry Johnson, Doug Hawks, Yong Liu
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Title:
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Semiconductor Die Packages with Stacked Flexible Modules Having Passive Components, Systems Using the Same, and Methods of Making the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 82 RUNNING HILL ROAD |
| SOUTH PORTLAND, MAINE 04106 |
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| TOWNSEND AND TOWNSEND AND CREW LLP |
| TWO EMBARCADERO CENTER |
| EIGHTH FLOOR |
| SAN FRANCISCO, CA 94111 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5005 E. MCDOWELL ROAD, MD A700 |
| PHOENIX, ARIZONA 85008 |
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| SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 5005 E. MCDOWELL ROAD |
| MD A700 |
| PHOENIX, AZ 85008 |
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