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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
06/14/2011
Application #:
12485727
Filing Dt:
06/16/2009
Publication #:
Pub Dt:
12/31/2009
Inventors:
Harry Hedler, Roland Irsigler
Title:
CHIP ARRANGEMENT AND METHOD OF MANUFACTURING A CHIP ARRANGEMENT
Assignment: 1
Reel/Frame:
022833/0333Recorded: 06/16/2009Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/25/2008
Exec Dt:
09/25/2008
Assignee:
GUSTAV-HEINEMANN-RING 212
MUNICH, GERMANY 81739
Correspondent:
SLATER & MATSIL, L.L.P.
17950 PRESTON RD.
SUITE 1000
DALLAS, TX 75252
Assignment: 2
Reel/Frame:
035623/0001Recorded: 05/08/2015Pages: 181
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/09/2014
Assignee:
AM CAMPEON 1-12
NEUBIBERG, GERMANY 85579
Correspondent:
CPA GLOBAL LIMITED
LIBERATION HOUSE
CASTLE STREET
ST HELIER, JE1 1BL JERSEY
Assignment: 3
Reel/Frame:
036575/0670Recorded: 09/09/2015Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/08/2015
Assignee:
29 EARLSFORT TERRACE, DUBLIN 2
DUBLIN, IRELAND
Correspondent:
POLARIS INNOVATIONS LIMITED
303 TERRY FOX DRIVE, SUITE 300
OTTAWA, K2K 3J1 CANADA

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