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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
06/03/2014
Application #:
12376127
Filing Dt:
02/03/2009
Publication #:
Pub Dt:
01/07/2010
Inventors:
Keigo Higaki, Yasuhiko Itou
Title:
THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE
Assignment: 1
Reel/Frame:
022212/0359Recorded: 02/05/2009Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/05/2009
Exec Dt:
01/14/2009
Assignee:
15-5, SHINTOMI 2-CHOME, CHUO-KU
TOKYO, JAPAN 104-0041
Correspondent:
OBLON, SPIVAK, ET AL.
1940 DUKE STREET
ALEXANDRIA, VA 22314
Assignment: 2
Reel/Frame:
052476/0264Recorded: 04/23/2020Pages: 17
Conveyance:
CHANGE OF NAME AND ADDRESS
Assignor:
Exec Dt:
03/03/2020
Assignee:
1-9-2, HIGASHI-SHIMBASHI
MINATO-KU, TOKYO, JAPAN
Correspondent:
DANIEL M. GURFINKEL
DENNEMEYER & ASSOCIATES, LLC
2 NORTH RIVERSIDE PLAZA, SUITE 1500
CHICAGO, IL 60606

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