Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/04/2011
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Application #:
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12507188
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Filing Dt:
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07/22/2009
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Publication #:
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Pub Dt:
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01/28/2010
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Inventors:
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Junji SHIOTA, Talsuke Koroku, Nobumitsu Fujii, Osamu Kuwabara, Osamu Okada
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Title:
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SEMICONDUCTOR DEVICE CAPABLE OF SUPPRESSING WARPING IN A WAFER STATE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-2, HONMACHI 1-CHOME, SHIBUYA-KU |
| TOKYO, JAPAN 151-8543 |
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| FRISHAUF, HOLTZ, GOODMAN & CHICK, PC |
| 220 FIFTH AVENUE |
| 16TH FLOOR |
| NEW YORK, NY 10001-7708 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10-6, IMAI 3-CHOME, OME-SHI, |
| TOKYO,, JAPAN 198-8555 |
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| LEONARD HOLTZ |
| 220 FIFTH AVENUE |
| 16TH FLOOR |
| NEW YORK, NY 10001 |
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