Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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11/29/2011
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Application #:
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12506503
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Filing Dt:
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07/21/2009
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Publication #:
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Pub Dt:
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01/28/2010
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Inventors:
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Ichiro MIHARA, Takeshi Wakabayashi
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Title:
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METHOD OF FORMING WIRING ON A PLURALITY OF SEMICONDUCTOR DEVICES FROM A SINGLE METAL PLATE, AND A SEMICONDUCTOR CONSTRUCTION ASSEMBLY FORMED BY THE METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-2, HON-MACHI 1-CHOME, SHIBUYA-KU |
| TOKYO, JAPAN 151-8543 |
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| LEONARD HOLTZ |
| 220 FIFTH AVENUE |
| 16TH FLOOR |
| NEW YORK, NY 10001 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10-6, IMAI 3-CHOME, OME-SHI, |
| TOKYO,, JAPAN 198-8555 |
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| LEONARD HOLTZ |
| 220 FIFTH AVENUE |
| 16TH FLOOR |
| NEW YORK, NY 10001 |
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Assignment:
3
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 2-7-17, SHIN-YOKOHAMA |
| KOUHOKU-KU |
| YOKOHAMA-SHI, JAPAN |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 828 |
| BRYANT E. WADE |
| BLOOMFIELD HILLS, MI 48303 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 455-1, KOHZAI-MINAMIMACHI |
| TAKAMATSU-SHI |
| KAGAWA, JAPAN 761-8014 |
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| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 828 |
| BRYANT E. WADE |
| BLOOMFIELD HILLS, MI 48303 |
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