Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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12/06/2011
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Application #:
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10577173
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Filing Dt:
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10/27/2009
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Publication #:
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Pub Dt:
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02/11/2010
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Inventors:
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Wolfgang Hetzel, Jochen Thomas
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Title:
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SEMICONDUCTOR DEVICE WITH PLASTIC PACKAGE MOLDING COMPOUND, SEMICONDUCTOR CHIP AND LEADFRAME AND METHOD FOR PRODUCING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| GUSTAV-HEINEMANN-RING 212 |
| MUNICH, GERMANY 81739 |
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| BARRY E. BRETSCHNEIDER |
| C/O MORRISON & FOERSTER LLP |
| 1650 TYSONS BOULEVARD SUITE 400 |
| MCLEAN, VA 22102 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| GUSTAV-HEINEMANN-RING 212 |
| MUNICH, GERMANY 81739 |
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| MARK L. GLEASON |
| FIFTH ST. TOWERS, 100 SOUTH FIFTH ST. |
| SUITE 2250 |
| MINNEAPOLIS, MN 55402 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AM CAMPEON 1-12 |
| NEUBIBERG, GERMANY 85579 |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JE1 1BL JERSEY |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 29 EARLSFORT TERRACE, DUBLIN 2 |
| DUBLIN, IRELAND |
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| POLARIS INNOVATIONS LIMITED |
| 303 TERRY FOX DRIVE, SUITE 300 |
| OTTAWA, K2K 3J1 CANADA |
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