Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12462208
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Filing Dt:
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07/30/2009
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Publication #:
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Pub Dt:
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02/25/2010
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Inventors:
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Belgacem Haba, Chang Myung Ryu, Kimitaka Endo, Christopher Paul Wade
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Title:
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Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layer
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3025 ORCHARD PARKWAY |
SAN JOSE, CALIFORNIA 95134 |
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DARYL K. NEFF |
LERNER, DAVID, LITTENBERG, KRUMHOLZ |
& MENTLIK, LLP |
600 SOUTH AVENUE WEST |
WESTFIELD, NJ 07090 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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2702 ORCHARD PARKWAY |
SAN JOSE, CALIFORNIA USA 95134 |
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DARYL K. NEFF |
LERNER, DAVID, LITTENBERG, KRUMHOLZ |
& MENTLIK, LLP |
600 SOUTH AVENUE WEST |
WESTFIELD, NJ 07090 |
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