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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
12548567
Filing Dt:
08/27/2009
Publication #:
Pub Dt:
02/25/2010
Inventors:
Brian Samuel Beaman, Keith Edward Fogel, Paul Alfred Lauro, Maurice Heathcote Norcott et al
Title:
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS OF USE THEREOF
Assignment: 1
Reel/Frame:
036550/0001Recorded: 09/03/2015Pages: 983
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/29/2015
Assignee:
2070 ROUTE 52
HOPEWELL JUNCTION, NEW YORK 12533
Correspondent:
HESLIN ROTHENBERG FARLEY & MESITI P.C.
5 COLUMBIA CIRCLE
ALBANY, NY 12203
Assignment: 2
Reel/Frame:
036779/0001Recorded: 10/05/2015Pages: 985
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/10/2015
Exec Dt:
09/10/2015
Assignee:
PO BOX 309
UGLAND HOUSE
GRAND CAYMAN, CAYMAN ISLANDS KY1-1104
Correspondent:
HESLIN ROTHENBERG FARLEY & MESITI P.C.
5 COLUMBIA CIRCLE
ALBANY, NY 12203

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