Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12483571
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Filing Dt:
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06/12/2009
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Publication #:
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Pub Dt:
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03/04/2010
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Inventors:
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Thomas Werner, Kai Frohberg, Frank Feustel
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Title:
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USING A CAP LAYER IN METALLIZATION SYSTEMS OF SEMICONDUCTOR DEVICES AS A CMP AND ETCH STOP LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5204 EAST BEN WHITE BOULEVARD |
| AUSTIN, TEXAS 78741 |
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| J. MIKE AMERSON |
| 10333 RICHMOND, SUITE 1100 |
| HOUSTON, TX 77042 |
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