Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
04/12/2011
|
Application #:
|
12198227
|
Filing Dt:
|
08/26/2008
|
|
Publication #:
|
|
Pub Dt:
|
03/04/2010
| | | | |
|
Inventors:
|
Mohammad Khan, Jun Zhai, Ranjit Gannamani, Raj N. Master
|
|
Title:
|
SEMICONDUCTOR CHIP WITH SOLDER JOINT PROTECTION RING
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| ONE AMD PLACE, PO BOX 3453 |
| PAUL S. DRAKE |
| SUNNYVALE, CALIFORNIA 94088-3453 |
|
|
|
|
| TIMOTHY M. HONEYCUTT |
| PO BOX 1577 |
| CYPRESS, TX 77410-1577 |
|
|
Search Results as of:
05/09/2024 04:34 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
