Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12206710
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Filing Dt:
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09/08/2008
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Publication #:
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Pub Dt:
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03/04/2010
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Inventors:
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Ching-cherng SUN, Tsung-Xian Lee
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Title:
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Method of Packaging Light Emitting Diode on Through-Hole Substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.300, JHONGDA RD. |
| JHONGLI CITY, TAOYUAN COUNTY, TAIWAN 320 |
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| CHUN-MING SHIH |
| 13611 NORTHBOURNE DR. |
| CENTREVILLE, VA 20120 |
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