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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
07/12/2011
Application #:
12512229
Filing Dt:
07/30/2009
Publication #:
Pub Dt:
03/04/2010
Inventors:
Hiromichi Isogai, Takeshi Senda, Eiji Toyoda, Kumiko Murayama, Susumu Maeda et al
Title:
MANUFACTURING METHOD FOR SILICON WAFER
Assignment: 1
Reel/Frame:
023506/0280Recorded: 11/12/2009Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/29/2009
Exec Dt:
10/29/2009
Exec Dt:
10/29/2009
Exec Dt:
10/29/2009
Exec Dt:
10/29/2009
Exec Dt:
10/29/2009
Exec Dt:
10/29/2009
Assignee:
6-3, OHSAKI 1-CHOME, SHINAGAWA-KU
TOKYO, JAPAN 141-0032
Correspondent:
PAVAN K. AGARWAL
FOLEY & LARDNER LLP SUITE 500
3000 K STREET, N.W.
WASHINGTON, DC 20007-5143
Assignment: 2
Reel/Frame:
029962/0497Recorded: 03/11/2013Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/26/2012
Assignee:
6-861-5, SEIRO-MACHI HIGASHIKO
KITAKANBARA-GUN
NIIGATA, JAPAN 957-0197
Correspondent:
ROBERT G. MUKAI
1737 KING STREET
SUITE 500
ALEXANDRIA, VA 22314
Assignment: 3
Reel/Frame:
029991/0421Recorded: 03/13/2013Pages: 15
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/07/2013
Assignee:
6-861-5, SEIRO-MACHI HIGASHIKO
KITAKANBARA-GUN
NIIGATA, JAPAN 957-0197
Correspondent:
BUCHANAN INGERSOLL & ROONEY PC
1737 KING STREET
SUITE 500
ALEXANDRIA, VA 22314

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