Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12528726
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Filing Dt:
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08/26/2009
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Publication #:
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Pub Dt:
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03/04/2010
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Inventors:
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Munemitsu Hirotsu, Yoshiharu Shimada
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Title:
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EPDM SEALING COMPOUND AND LID COATED WITH THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-1, UCHISAIWAI-CHO 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100-8522 |
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| 2-1, OAZA SHONOU, KISA-MACHI |
| KITASAITAMA-GUN, SAITAMA, JAPAN 347-0107 |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20037 |
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Assignment:
2
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| 18-1, HIGASHI-GOTANDA 2-CHOME |
| SHINAGAWA-KU, TOKYO, JAPAN 141-8640 |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE NW, SUITE 800 |
| WASHINGTON, DC 20037 |
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