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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
12555997
Filing Dt:
09/09/2009
Publication #:
Pub Dt:
03/11/2010
Inventor:
Shinji WAKISAKA
Title:
SEMICONDUCTOR DEVICE HAVING AN INTERLAYER INSULATING FILM WIRING LAMINATED STRUCTURE SECTION AND METHOD OF FABRICATING THE SAME
Assignment: 1
Reel/Frame:
023205/0725Recorded: 09/09/2009Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/03/2009
Assignee:
6-2, HON-MACHI, 1-CHOME, SHIBUYA-KU,
TOKYO, JAPAN 151-8543
Correspondent:
FRISHAUF, HOLTZ, GOODMAN & CHICK, PC
220 FIFTH AVENUE
16TH FLOOR
NEW YORK, NY 10001-7708
Assignment: 2
Reel/Frame:
027145/0373Recorded: 10/31/2011Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/28/2011
Assignee:
10-6, IMAI 3-CHOME, OME-SHI,
TOKYO,, JAPAN 198-8555
Correspondent:
LEONARD HOLTZ
220 FIFTH AVENUE
16TH FLOOR
NEW YORK, NY 10001

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