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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
12585149
Filing Dt:
09/04/2009
Publication #:
Pub Dt:
03/11/2010
Inventor:
Tamotsu Iida
Title:
Component having through-hole and method of manufacturing component
Assignment: 1
Reel/Frame:
023232/0400Recorded: 09/04/2009Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/24/2009
Assignee:
1-1-88, USHITORA, IBARAKI-SHI
OSAKA, JAPAN 567-8567
Correspondent:
JAMES A. OLIFF
OLIFF & BERRIDGE, PLC
P.O. BOX 320850
ALEXANDRIA, VA 22320-4850
Assignment: 2
Reel/Frame:
026444/0298Recorded: 06/13/2011Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/27/2011
Assignee:
1, KOIZUMI, OYAMAZAKI-CHO
OTOKUNI-GUN
KYOTO 618-8525, JAPAN
Correspondent:
JAMES A. OLIFF
OLIFF & BERRIDGE, PLC
P.O. BOX 320850
ALEXANDRIA, VA 22320-4850

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