Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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10/12/2010
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Application #:
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12546432
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Filing Dt:
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08/24/2009
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Publication #:
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Pub Dt:
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03/18/2010
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Inventors:
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Wilmer R. Bottoms, Fu Chiung Chong, Sammy Mok, Douglas Modlin
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Title:
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HIGH DENSITY INTERCONNECT SYSTEM FOR IC PACKAGES AND INTERCONNECT ASSEMBLIES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1100 LA AVENIDA STREET |
BUILDING A |
MOUNTAIN VIEW, CALIFORNIA 94043 |
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GREGORY W. OSTERLOTH |
P.O. BOX 8749 |
DENVER, CO 80201 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 1 YISHUN AVENUE 7 |
SINGAPORE, SINGAPORE 768923 |
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GREGORY W. OSTERLOTH |
P.O. BOX 8749 |
DENVER, CO 80201 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1, YISHUN AVENUE 7 |
SINGAPORE, SINGAPORE 768923 |
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GREGORY W. OSTERLOTH |
555 17TH STREET, SUITE 3200 |
DENVER, CO 80202 |
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