Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12284536
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Filing Dt:
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09/23/2008
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Publication #:
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Pub Dt:
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03/25/2010
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Inventors:
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Kenji Sugawara, Yong Chen
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Title:
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Wire bonding method
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Assignment:
1
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL 022449 FRAME 0101. THE ASSIGNOR HEREBY CONFIRMS THE ASSIGNMENT.
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| 11 HINES ROAD |
| SUITE 203 |
| OTTAWA, CANADA K2K 2X1 |
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| MOSAID TECHNOLOGIES INCORPORATED |
| 11 HINES ROAD |
| SUITE 203 |
| OTTAWA, CANADA K2K 2X1 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-51-1, INADAIRA |
| MUSASHIMURAYAMA-SHI, TOKYO, JAPAN |
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| WILLIAM L. ANDROLIA |
| QUINN EMANUEL URGUHART OLIVER & ET AL |
| 865 SOUTH FIGUEROA STREET, 10TH FLOOR |
| LOS ANGELES, CALIFORNIA 90017 |
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