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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
12237078
Filing Dt:
09/24/2008
Publication #:
Pub Dt:
03/25/2010
Inventors:
Arkadii V. Samoilov, Duane Thomas Wilcoxen, Viren V. Khandekar, Vivek Jain et al
Title:
High-Electrical-Current Wafer Level Packaging, High-Electrical-Current WLP Electronic Devices, and Methods of Manufacture Thereof
Assignment: 1
Reel/Frame:
021814/0943Recorded: 11/11/2008Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/23/2008
Exec Dt:
09/23/2008
Exec Dt:
09/23/2008
Exec Dt:
09/23/2008
Exec Dt:
09/19/2008
Exec Dt:
09/19/2008
Assignee:
120 SAN GABRIEL DRIVE
SUNNYVALE, CALIFORNIA 94086
Correspondent:
BLAKELY SOKOLOFF TAYLOR & ZAFMAN LLP
1279 OAKMEAD PARKWAY
SUNNYVALE, CA 94085

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