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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/05/2014
Application #:
12517042
Filing Dt:
05/29/2009
Publication #:
Pub Dt:
03/25/2010
Inventors:
Sadayuki Yoneshima, Masayuki Sakai, Hisao Aota, Hiroshi Watanabe, Mitsuaki Samejima et al
Title:
MOLD FOR RESIN MOLDING, METHOD FOR MANUFACTURING MOLD FOR RESIN MOLDING, AND RESIN MOLDED PRODUCT
Assignment: 1
Reel/Frame:
022756/0290Recorded: 05/29/2009Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/14/2009
Exec Dt:
04/14/2009
Exec Dt:
04/14/2009
Exec Dt:
04/14/2009
Exec Dt:
04/14/2009
Exec Dt:
04/14/2009
Assignee:
1-10, NISHIISHIKIRI-CHO 2-CHOME, HIGASHIOSAKA-SHI
OSAKA, JAPAN 5798013
Correspondent:
RABIN & BERDO, P.C.
1101 14TH ST. N.W.
SUITE 500
WASHINGTON, DC 20005

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