Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/19/2013
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Application #:
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12572326
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Filing Dt:
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10/02/2009
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Publication #:
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Pub Dt:
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04/08/2010
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Inventors:
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Satoshi ITAYA, Dai SASAKI, Mitsuaki KATAGIRI
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Title:
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SEMICONDUCTOR DEVICE AND METHOD OF BONDING WIRES BETWEEN SEMICONDUCTOR CHIP AND WIRING SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1, YAESU 2-CHOME, CHUO-KU |
| TOKYO, JAPAN 104-0028 |
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| YOUNG & THOMPSON |
| 209 MADISON STREET |
| SUITE 500 |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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| 250 2-1, YAESU 2-CHOME, CHUO-KU |
| TOKYO, JAPAN 104-0028 |
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| THOMAS H. JENKINS |
| FINNEGAN, HENDERSON, FARABOW, GARRETT |
| & DUNNER, L.L.P. |
| 901 NEW YORK AVENUE, N.W. |
| WASHINGTON, D.C. 20001-4413 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 208, VAL DES BONS MALADES |
| LUXEMBOURG, LUXEMBOURG L-2121 |
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| CONVERSANT INTELLECTUAL PROPERTY MGMT |
| 5700 GRANITE PARKWAY |
| SUITE 960 |
| PLANO, TX 75024 |
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