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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/06/2012
Application #:
12250239
Filing Dt:
10/13/2008
Publication #:
Pub Dt:
04/15/2010
Inventors:
Shen-Nan Lee, Ying-Mei Lin, Yu-Jen Cheng, Huan-Just Lin, Keung Hui
Title:
CHEMICAL MECHANICAL POLISH PROCESS CONTROL FOR IMPROVEMENT IN WITHIN-WAFER THICKNESS UNIFORMITY
Assignment: 1
Reel/Frame:
021674/0337Recorded: 10/13/2008Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/08/2008
Exec Dt:
10/08/2008
Exec Dt:
10/08/2008
Exec Dt:
10/08/2008
Exec Dt:
10/08/2008
Assignee:
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77 R.O.C.
Correspondent:
SLATER & MATSIL, L.L.P.
17950 PRESTON ROAD
SUITE 1000
DALLAS, TX 75252

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