Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/24/2012
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Application #:
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12254536
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Filing Dt:
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10/20/2008
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Publication #:
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Pub Dt:
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04/22/2010
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Inventors:
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Richard Ruby, James P. Roland, Frank S. Geefay
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Title:
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BONDED WAFER STRUCTURE AND METHOD OF FABRICATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768923 |
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| SCOTT A. WEITZEL, ESQ. |
| AVAGO TECHNOLOGIES, LTD. |
| 4380 ZIEGLER ROAD |
| FORT COLLINS, CO 80525 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| NO. 1 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768923 |
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| KATHY MANKE |
| 4380 ZIEGLER ROAD |
| FORT COLLINS, CO 80525 |
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