Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12374285
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Filing Dt:
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11/17/2009
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Publication #:
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Pub Dt:
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04/22/2010
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Inventors:
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Kouji Watanabe, Kazuyuki Shohara, Shota Matsuda, Masateru Fukuoka, Yoshiyuki Takebe
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Title:
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DICING/DIE-BONDING TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-4, NISHITEMMA 2-CHOME, KITA-KU |
| OSAKA-CITY, OSAKA, JAPAN 530-8565 |
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| LEE CHENG |
| 1100 17TH STREET N.W. STE 503 |
| WASHINGTON, DC 20036 |
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