Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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01/10/2012
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Application #:
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12259216
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Filing Dt:
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10/27/2008
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Publication #:
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Pub Dt:
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04/29/2010
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Inventors:
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YI XIANG WANG, JUYING DOU, JUN JIANT, ZHENG FAN, QINGYU MENG, Jay Chen, Kenichi Kanai
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Title:
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WAFER GROUNDING METHODOLOGY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5F NO. 18 CREATION ROAD 1 |
| HSINCHU SCIENCE PARK |
| HISNCHU, 300, TAIWAN |
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| SAWYER LAW GROUP LLP |
| 2465 E. BAYSHORE ROAD, SUITE NO. 406 |
| PALO ALTO, CA 94303 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5F, NO. 18, CREATION ROAD 1 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
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| SAWYER LAW GROUP, P.C. |
| P.O. BOX 51418 |
| PALO ALTO, CA 94303 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| DE RUN 6501 |
| VELDHOVEN, NETHERLANDS 5504 DR |
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| FINNEGAN, HENDERSON, FARABOW, GARRETT & DUNNER LLP |
| 901 NEW YORK AVENUE, NW |
| WASHINGTON, DC 20001 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| DE RUN 6501 |
| VELDHOVEN, NETHERLANDS 5504 DR |
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| FINNEGAN, HENDERSON, FARABOW, GARRETT & DUNNER LLP |
| 901 NEW YORK AVENUE, NW |
| WASHINGTON, DC 20001 |
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