Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/10/2012
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Application #:
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12530247
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Filing Dt:
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10/28/2009
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Publication #:
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Pub Dt:
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04/29/2010
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Inventors:
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Akihiko Sano, Hiroto Nozawa, Naru Yasuda, Hayami Hosokawa
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Title:
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PACKAGE MANUFACTURING METHOD, PACKAGE, OPTICAL MODULE AND DIE FOR INTEGRAL MOLDING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 801, MINAMIFUDODO-CHO, HORIKAWAHIGASHIIRU |
| SHIOKOJI-DORI, SHIMOGYO-KU, |
| KYOTO-SHI, KYOTO, JAPAN 600-8530 |
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| THOMAS K. SCHERER |
| 909 FANNIN STREET |
| SUITE 3500 |
| HOUSTON, TX 77010 |
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