Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/10/2012
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Application #:
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12289745
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Filing Dt:
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11/03/2008
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Publication #:
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Pub Dt:
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05/06/2010
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Inventors:
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Yoshitaka Sasaki, Hiroyuki Ito, Tatsuya Harada, Nobuyuki Okuzawa, Hiroshi Ikejima et al
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Title:
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LAYERED CHIP PACKAGE WITH HEAT SINK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 678 S. HILLVIEW DR. |
| MILPITAS, CALIFORNIA 95035 |
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| 1-13-1, NIHONBASHI |
| CHUO-KU |
| TOKYO 103-8272, JAPAN |
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| SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE |
| HONG KONG SCIENCE PARK |
| SHATIN, N.T. HONG KONG, CHINA |
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| JAMES A. OLIFF |
| OLIFF & BERRIDGE, PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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