Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/17/2012
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Application #:
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12565323
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Filing Dt:
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09/23/2009
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Publication #:
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Pub Dt:
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05/06/2010
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Inventors:
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Holger Schuehrer, Juergen Boemmels
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Title:
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REDUCING METAL VOIDS IN A METALLIZATION LAYER STACK OF A SEMICONDUCTOR DEVICE BY PROVIDING A DIELECTRIC BARRIER LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5204 EAST BEN WHITE BOULEVARD |
| AUSTIN, TEXAS 78741 |
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| J. MIKE AMERSON |
| 10333 RICHMOND, SUITE 1100 |
| HOUSTON, TX 77042 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| 8110 GATEHOUSE RD. |
| SUITE 100 EAST |
| FALLS CHURCH, VA 22042 |
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