Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12688563
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Filing Dt:
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01/15/2010
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Publication #:
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Pub Dt:
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05/13/2010
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Inventors:
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Sayaka HIRAFUNE, Tatsuo SUEMASU
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Title:
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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-1, KIBA 1-CHOME |
| KOHTOH-KU, TOKYO, JAPAN 135-8512 |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE, NW |
| WASHINGTON, DC 20037-3213 |
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