Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/15/2011
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Application #:
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12275086
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Filing Dt:
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11/20/2008
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Publication #:
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Pub Dt:
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05/20/2010
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Inventors:
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Michael D. Gruenhagen, Suku Kim, Rohit Dikshit, James J. Murphy, Ihsiu Ho, Eddy Tjhia et al
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Title:
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SEMICONDUCTOR DIE STRUCTURES FOR WAFER-LEVEL CHIPSCALE PACKAGING OF POWER DEVICES, PACKAGES AND SYSTEMS FOR USING THE SAME, AND METHODS OF MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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82 RUNNING HILL ROAD |
SOUTH PORTLAND, MAINE 04106 |
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TOWNSEND AND TOWNSEND AND CREW LLP |
TWO EMBARCADERO CENTER |
EIGHTH FLOOR |
SAN FRANCISCO, CA 94111 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5005 E. MCDOWELL ROAD, MD A700 |
PHOENIX, ARIZONA 85008 |
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SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
5005 E. MCDOWELL ROAD |
MD A700 |
PHOENIX, AZ 85008 |
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