Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/18/2014
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Application #:
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12273434
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Filing Dt:
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11/18/2008
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Publication #:
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Pub Dt:
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05/20/2010
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Inventors:
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Xunqing Shi, Bin Xie, Chang Hwa Chung
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Title:
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SEMICONDUCTOR CHIP WITH THROUGH-SILICON-VIA AND SIDEWALL PAD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3/F, BUILDING 6, 2 SCIENCE PARK WEST AVENUE, HONG KONG SCIENCE PARK, SHATIN |
| NEW TERRITORIES, HONG KONG |
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| BERKELEY LAW & TECHNOLOGY GROUP, LLP |
| 17933 NW EVERGREEN PARKWAY, SUITE 250 |
| BEAVERTON, OR 97006 |
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