Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12327811
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Filing Dt:
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12/03/2008
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Publication #:
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Pub Dt:
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06/03/2010
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Inventors:
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Byung Tai Do, Reza Argenty Pagaila, Linda Pei Ee Chua
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND FLIP CHIP AND METHOD OF MANUFACTURE THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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| LAW OFFICES OF MIKIO ISHIMARU |
| 333 W. EL CAMINO REAL |
| SUITE 330 |
| SUNNYVALE, CA 94087 |
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