Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/02/2011
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Application #:
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12472359
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Filing Dt:
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05/26/2009
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Publication #:
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Pub Dt:
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06/10/2010
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Inventors:
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Jui-Ching Hsieh, Pin Chang, Chung-De Chen, Li-Chi Pan, Yu-Jen Wang, Chin-Horng Wang
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Title:
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CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 195, SEC. 4, CHUNG HSING RD. |
| CHUTUNG |
| HSINCHU, TAIWAN 31040 |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7F-1, NO.100, ROOSEVELT RD., SEC.2 |
| TAIPEI, 100 TAIWAN |
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