Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/30/2012
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Application #:
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12696185
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Filing Dt:
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01/29/2010
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Publication #:
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Pub Dt:
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06/10/2010
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Inventors:
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Daniel Michaels, William E. Boyd
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Title:
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STACKED BALL GRID ARRAY PACKAGE MODULE UTILIZING ONE OR MORE INTERPOSER LAYERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2711 CENTERVILLE ROAD, SUITE 400 |
| WILMINGTON, DELAWARE 19808 |
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| PAUL S. HUNTER |
| FOLEY & LARDNER LLP |
| 150 E. GILMAN ST. |
| MADISON, WI 53703 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 2711 CENTERVILLE RD |
| SUITE 400 |
| WILMINGTON, DELAWARE 19808 |
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| FOLEY & LARDNER LLP |
| 150 EAST GILMAN STREET |
| VEREX PLAZA |
| MADISON, WI 53703 |
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