Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12632054
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Filing Dt:
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12/07/2009
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Publication #:
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Pub Dt:
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06/10/2010
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Inventors:
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TAISUKE KOROKU, OSAMU OKADA, OSAMU KUWABARA, JUNJI SHIOTA, NOBUMITSU FUJII
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE IN WHICH BOTTOM SURFACE AND SIDE SURFACE OF SEMICONDUCTOR SUBSTRATE ARE COVERED WITH RESIN PROTECTIVE FILM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-2, HON-MACHI, 1-CHOME, SHIBUYA-KU, |
| TOKYO, JAPAN 151-8543 |
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| FRISHAUF, HOLTZ, GOODMAN & CHICK, PC |
| 220 FIFTH AVENUE |
| 16TH FLOOR |
| NEW YORK, NY 10001-7708 |
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Assignment:
2
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CHANGE OF OWNERSHIP BY CORPORATE SEPARATION
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| 6-2, HON-MACHI 1-CHOME |
| SHIBUYA-KU, TOKYO 151-8543, JAPAN |
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| HOLTZ, HOLTZ, GOODMAN & CHICK PC |
| 220 FIFTH AVENUE |
| 16TH FLOOR |
| NEW YORK NY 10001-7708 |
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Assignment:
3
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CHANGE OF OWNERSHIP BY CORPORATE SEPARATION-TO CORRECT ASSIGNEE'S ADDRESS ON REEL 027520/FRAME 0401
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| 10-6 IMAI 3-CHOME, OME-SHI |
| TOKYO 198-8555, JAPAN |
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| HOLTZ, HOLTZ, GOODMAN & CHICK PC |
| 220 FIFTH AVENUE |
| 16TH FLOOR |
| NEW YORK NY 10001-7708 |
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