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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
12303778
Filing Dt:
12/08/2008
Publication #:
Pub Dt:
06/17/2010
Inventors:
Nobuhiro Mikami, Shinji Watanabe, Atsumasa Sawada, Junya Sato
Title:
SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING SAME, SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
Assignment: 1
Reel/Frame:
021937/0537Recorded: 12/08/2008Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/19/2008
Exec Dt:
11/19/2008
Exec Dt:
11/19/2008
Exec Dt:
11/19/2008
Assignee:
7-1, SHIBA 5-CHOME, MINATO-KU
TOKYO, JAPAN 108-8001
Correspondent:
SCULLY SCOTT MURPHY & PRESSER, PC
400 GARDEN CITY PLAZA
SUITE 300
GARDEN CITY, NY 11530

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