Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/28/2012
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Application #:
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12634350
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Filing Dt:
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12/09/2009
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Publication #:
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Pub Dt:
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06/17/2010
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Inventors:
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Takashi ODA, Shigenori MORITA, Naoko YOSHIDA
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Title:
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MANUFACTURING METHOD OF TRANSFERRING A WIRING CIRCUIT LAYER ON A METAL SUPPORT SUBSTRATE TO A SEMICONDUCTOR ELEMENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-2, SHIMOHOZUMI 1-CHOME |
| IBARAKI-SHI, JAPAN 567-8680 |
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| LEYDIG VOIT & MAYER, LTD |
| TWO PRUDENTIAL PLAZA, SUITE 4900 |
| 180 NORTH STETSON AVENUE |
| CHICAGO, IL 60601-6731 |
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