Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12457002
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Filing Dt:
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05/28/2009
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Publication #:
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Pub Dt:
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06/24/2010
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Inventors:
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Chul Min Lee, Sung Wook Chun, Dek Gin Yang, Kyung Jin Heo, Young Ho Lee, Dong-Gi An
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Title:
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Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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314 MAETAN 3-DONG, |
YEONGTONG-GU, SUWON |
GYUNGGI-DO, KOREA, REPUBLIC OF 443-743 |
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11, 91 BLOCK, NAMDONG INDUSTRIAL PARK |
670-10 GOJAN-DONG |
NAMDONG-GU, INCHEON-SI, KOREA, REPUBLIC OF 405-819 |
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STAAS & HALSEY LLP |
ATTENTION: DAVID M. PITCHER |
1201 NEW YORK AVENUE, N.W. |
SUITE 700 |
WASHINGTON, D.C. 20005 |
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