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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
12653683
Filing Dt:
12/17/2009
Publication #:
Pub Dt:
07/01/2010
Inventors:
Masahiro Izumi, Masaru Nakajo, Yukiyo Saito, Kuniaki Maejima, Hiroaki Tanaka
Title:
Polishing composition for semiconductor wafer
Assignment: 1
Reel/Frame:
023916/0101Recorded: 02/09/2010Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/01/2009
Exec Dt:
12/01/2009
Exec Dt:
12/08/2009
Exec Dt:
12/01/2009
Exec Dt:
12/01/2009
Assignees:
11-1 KAMEIDO 9-CHOME, KOTO-KU
TOKYO, JAPAN
2647 HAYAKAWA
AYASE-SHI, KANAGAWA, JAPAN
Correspondent:
FLYNN, THIEL, BOUTELL & TANIS, P.C.
2026 RAMBLING ROAD
KALAMAZOO, MI 49008-1631

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