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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/07/2011
Application #:
12644312
Filing Dt:
12/22/2009
Publication #:
Pub Dt:
07/01/2010
Inventor:
Takashi Sakai
Title:
METHOD OF PRODUCING BONDED SILICON WAFER
Assignment: 1
Reel/Frame:
023789/0797Recorded: 01/14/2010Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/04/2009
Assignee:
2-1, SHIBAURA 1-CHOME
MINATO-KU, TOKYO, JAPAN 105-8634
Correspondent:
LAURA A. CRUZ, ESQ.
CHRISTENSEN O'CONNOR JOHNSON KINDNESS
1420 FIFTH AVENUE, SUITE 2800
SEATTLE, WA 98101-2347

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