Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12663433
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Filing Dt:
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03/01/2010
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Publication #:
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Pub Dt:
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07/15/2010
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Inventors:
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Seok-Ju Kim, Eun-Il Jeong, Hyu-Bum Park, Deok-Su Han
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Title:
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CMP Slurry Composition for Copper Damascene Process
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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6-4, SUNAE-DONG, BUNDANG-GU, GYEONGGI-DO |
SEONGNAM-CITY, KOREA, REPUBLIC OF 463-825 |
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THE WEBB LAW FIRM, P.C. |
700 KOPPERS BUILDING |
436 SEVENTH AVENUE |
PITTSBURGH, PA 15219 |
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