Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12654928
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Filing Dt:
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01/08/2010
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Publication #:
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Pub Dt:
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07/22/2010
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Inventor:
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Takanori Yamashita
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Title:
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Semiconductor device which exposes die pad without covered by interposer and its manufacturing method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1753 SHIMONUMABE, NAKAHARA-KU |
| KAWASAKI, KANAGAWA, JAPAN 211-8668 |
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| SEAN M. MCGINN, ESQ. |
| MCGINN INTELLECTUAL PROPERTY LAW GROUP, |
| PLLC |
| 8321 OLD COURTHOUSE ROAD, SUITE 200 |
| VIENNA, VIRGINIA 22182-3817 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1753 SHIMONUMABE, NAKAHARA-KU, |
| KAWASAKI-SHI, KANAGAWA, JAPAN 211-8668 |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20037 |
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