Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/19/2010
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Application #:
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12357664
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Filing Dt:
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01/22/2009
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Publication #:
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Pub Dt:
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07/22/2010
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Inventors:
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Kai Di Feng, Louis Lu-Chen Hsu, Zhijian Yang, Ping-Chuan Wang
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Title:
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3D CHIP-STACK WITH FUSE-TYPE THROUGH SILICON VIA
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| INTERNATIONAL BUSINESS MACHINES CORP. |
| 2070 ROUTE 52 |
| M/D 0482 |
| HOPEWELL JUNCTION, NY 12533 |
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