Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/06/2011
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Application #:
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12714441
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Filing Dt:
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02/27/2010
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Publication #:
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Pub Dt:
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07/29/2010
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Inventors:
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Sheng-Nan Tsai, Yi-Fan Wu, Chia-Cheng Yang, Tsung-Hsiao Wu, Jia-Li Tsai, Yung-Yu Chang et al
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Title:
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CONDUCTIVE MODULE AND ASSEMBLY STRUCTURE HAVING SUCH CONDUCTIVE MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 31-1, SHIEN PAN ROAD, KUEI SAN INDUSTRIAL ZONE |
| TAOYUAN HSIEN, TAIWAN 333 |
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| THOMAS M. HARDMAN |
| 170 SOUTH MAIN STREET, SUITE 735 |
| SALT LAKE CITY, UT 84101 |
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