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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
8003512
Issue Dt:
08/23/2011
Application #:
12364684
Filing Dt:
02/03/2009
Publication #:
20100193949
Pub Dt:
08/05/2010
Inventors:
Luc L. Belanger, Marc A. Bergendahl, Da-Yuan Shih, Valerie A. Oberson, Ajay P. Giri et al
Title:
NOVEL STRUCTURE OF UBM AND SOLDER BUMPS AND METHODS OF FABRICATION
Assignment: 1
Reel/Frame:
022293/0913Recorded: 02/23/2009Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
BELANGER, LUC L
Exec Dt:
12/09/2008
BERGENDAHL, MARC A
Exec Dt:
12/11/2008
GIRI, AJAY P
Exec Dt:
01/19/2009
LAURO, PAUL A
Exec Dt:
12/08/2008
OBERSON, VALERIE A
Exec Dt:
12/09/2008
SHIH, DA-YUAN
Exec Dt:
12/08/2008
Assignee:
IBM CORPORATION
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
JOSEPH PETROKAITIS
2070 RTE 52
482
HOPEWELL JUNCTION, NY 12533
Assignment: 2
Reel/Frame:
028867/0216Recorded: 08/29/2012Pages: 27
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
INTERNATIONAL BUSINESS MACHINES CORPORATION
Exec Dt:
07/18/2012
Assignee:
ULTRATECH, INC.
3050 ZANKER ROAD
SAN JOSE, CALIFORNIA 95134
Correspondent:
ALLSTON L. JONES
425 SHERMAN AVENUE, SUITE 230
PALO ALTO, CA 94306

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